The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Today, designers of compact electronic systems are faced with board space constraints, thus driving the requirement for alternative packaging technologies. Functional integration and miniaturization is the key to success!
To aid this miniaturization campaign, a new generation of Chip Diodes from Bourns has emerged that offers the capability to provide a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100% Tin terminations. All Bourns diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
Bourns¨ Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes rollaway.Click to the link below for all the documentation.
